Product Failure Analysis M/F
Shenzhen, China

Job description

1. Oriented on electrical analysis, defect localization within the package or the die , validation. Execution of physical analysis steps is also required (X-rays, sample preparation, SEM imaging)

2. The person will work among an international team, in collaboration with other FA teams in Shenzhen, Singapore, France, Italy and with daily contact with analysis requestors : product quality & reliability teams, engineering, design, as well as with FE and BE teams

3. Manage the FA cycle time to fulfill customer expectation

4. Manage the sample storage and FA document / record follow ISO / IEC 17025 and ST operation procedure

5. Follow the assignment from Lab manager for technical support and physical analysis base on need


  • 1. Teamwork, flexibility, pro-activity, high level of autonomy and analytical skills are required;
  • 2. Fluent English, both oral & written.

    3 Prefer to with semiconductor front end experience

    4. Microelectronic / electrical or material background

    Candidate criteria

    Education level required

    4 - Bachelor degree

    Experience level required

    01 / 07 / 2020


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