Overview The position is with SIP (system in package) group within the Division of Qualcomm Technologies. The position offers the candidate a chance to design next generation of wireless products that would shape the future of wireless industry.
A successful candidate will work with a highly motivated team to conduct board-level PCB design, schematic capture, system link budget analysis, debug, and test SIPs.
He / She will be responsible for a particular part of a complex system and work with the rest of the team to meet product design goals and specifications.
RF Hardware Engineers will support all aspects of RF design and project planning for wireless voice and data communications devices.
Provide radio design including RF system analysis, link budget, RX / TX architecture, filter requirements / design, detailed hardware design, PCB layout supervision, and component selection.
Applicant can expect to support a range of project requirements, R&D programs, and work in a multi-discipline environment. Minimum Qualifications
Candidates must have familiarity of wireless standards and a background in the design and test of wireless products and circuitry including CDMA, WCDMA, GSM, and LTE receivers, transmitters, and synthesizers.
Knowledge of GPS Receivers and Bluetooth, WiFi transceivers considered a plus. Should have experience in RF layout techniques using multi-
layered FR4 pwb material. Must be a self-starter who is capable of working independently. Minimum of 5 years RF engineering design experience.
Education Requirements Required : Bachelor's, Electrical Engineering or equivalent experience
Preferred : Master's, Electrical Engineering or equivalent experience Keywords